Provided is a photocurable silicone resin composition, which can form a cured product that has a broad range of complex elastic moduli that can be designed and has high damping properties and excellent shear elongation. This photocurable silicone resin composition comprises (A) a mercaptoalkyl group-containing organopolysiloxane, (B) a linear organopolysiloxane containing unsaturated aliphatic groups at least on the two ends, and (C) a photopolymerization initiator, wherein: component (A) comprises an organopolysiloxane (A1) containing mercaptoalkyl groups on the two ends, and an organopolysiloxane (A2) containing at least two silicon atom-binding mercaptoalkyl groups per one molecule; the ratio of the number of mercaptoalkyl groups in component (A) to the number of unsaturated aliphatic groups in component (B) is 0.70 to less than 1.00; and the ratio of the number of mercaptoalkyl groups in component (A1) to the number of unsaturated aliphatic groups in component (B) is at least 0.06.