Application Type
Invention
Application SubType
Invention PCT
(10) Registration Number and Date
Status
893/${sta2}
(180) Expiration Date
(20) Filing Number and Date
PH 1/2024/552662 2023.07.07
(40) Publication Number and Date
PH 1/2024/552662
U3
2025.05.05
(86) PCT Filing Number and Date
(87) PCT Publication Number and Date
(85) National Entry Date
(30) Priority Details
(71/73) Applicant
(72) Inventor
(74) Representative Name
(EN) ROMULO MABANTA BUENAVENTURA SAYOC & DE LOS ANGELES : 21ST FLOOR, AIA TOWER, 8767 PASEO DE ROXAS, MAKATI CITY
(54) Title
(EN) PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION
(57) Abstract
(EN)
A package comprising a first integrated device, a first metallization portion coupled to the first integrated device, a second integrated device, a second metallization portion coupled to the second integrated device and the first metallization portion, and an encapsulation layer coupled to the first metallization portion, the second integrated device and the second metallization portion. The first metallization portion includes at least one first dielectric layer and a first plurality of metallization interconnects. The second metallization portion includes at least one second dielectric layer and a second plurality of metallization interconnects.
(58) Citations